EDAPS 2017

EDAPS Committee

General Co-Chairs

Wen-Yan Yin, Erping Li

Technical Program Committee Co-Chairs

Junfa Mao, Gaofeng Wang

Technical Program Committee Vice Co-Chairs

Kai Kang, Liang Zhou, Dazhi Ding, Yang Xu, Linsheng Wu

Local Organization Committee Co-Chairs

Liandong Wang, Xueqin Yi, Qingfeng Zhang, Zhixiang Huang, Yingshui Xia


International Advisory Committee


Arun Chandrasekhar

Jianming Jin
Qing Huo Liu
Andreas C. Cangellaris
Jose Schutt-Aine
Ramachandra Achar
Antonio Orlandi
Joungho Kim
Rushan Chen
Christan Schuster
Jun Fan
Toshio Sudo
Dries Vande Ginste
Junfa Mao
Tzong-Lin Wu
Erping Li
Kai Kang
Wei Hong
Erxiao Liu
Ke-Li Wu
Wen-Yan Yin
Gaofeng Wang
Madhavan Swaminathan
Weng Cho Chew
Hideki Asai
Qiang Chen
Zhongxiang Shen
James L Drewniak




Technical Program Committee


Arun Chandrasekhar

Liandong Wang

Wensheng Zhao

Andreas Cangellaris

Linsheng Wu

Xiaoxiong Gu

Antonio Maffucci

Lingling Sun

Xiuying Zhang

Christan Schuster

Libo Qian

Xingchang Wei

Dries Vande Ginste
Madhavan Swaminathan
Xiamin Zhang
Fujiang Lin

Meisong Tong

Xiaochun Li

Gang Dai

Min Tang

Xiaoning Ye

Haiwen Liu

Pingqi Gao

Xiaopeng Yu

Hideki Asai

Qiang Chen

Xue Quan

Hongsheng Chen

Qifeng Liu

Xunya Jiang

Hongli Peng

Ran Hao

YaLi Wang

Hui Tan

Ramachandra Achar

Yi Zhao

Ivan Ndip

Sheng Sun

Yongle Wu

Jianyong Xie

Shaoqiu Xiao

Yongxin Guo

Jianyi Yang

Shurong Dong

Yonghu Zeng

Jian Wang

Taijun Liu

Yufeng Jin

Jose Schutt-Aine

Toshio Sudo

Yue Ping Zhang

Joungho Kim

Tzong-Lin Wu

Yujian Cheng

Jun Huang

Wenchao Chen

Zhenhong Fan

Kaixue Ma
Wenjian Yu
Zhizhang Chen
Ling Feng
Wenquan Che
Zhuo Cheng
Lijun Jiang
Wei Sha



Award Committee Co-Chairs

Yue Ping Zhang, Ke -Li Wu, Shurong Dong

Publicity Committee Co-Chairs

Yang Xu, Xingchang Wei

Sponsorship & Exhibition Co-Chairs

Shurong Dong, Linsheng Wu, Wenchao Chen

Finance Co-Chairs

Ran Hao, Hao Xie

Local Arrangements Co-Chairs

Yang Du, Xiaopeng Yu

Conference Secretary

Cheng Ning, Xinran Zhu (Sharon)

E-mail: ningch@zju.edu.cn , Zllnnj@zju.edu.cn

Andreas C Cangellaris

UIUC,

College of Engineering

Stochastic Electromagnetic Field Modeling for EMI/EMC-Aware Design of Electronic Systems

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life


Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application


Philip T. Krein

University of Illinois at Urbana-Champaign

Integrating thermal, electrical, and materials issues for extreme-density power electronics



Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging