EDAPS 2017

EDAPS Committee

General Co-Chairs

Wen-Yan Yin, Erping Li

Technical Program Committee Co-Chairs

Junfa Mao, Gaofeng Wang

Technical Program Committee Vice Co-Chairs

Kai Kang, Liang Zhou, Dazhi Ding, Yang Xu

Local Organization Committee Co-Chairs

Liandong Wang, Xueqin Yi, Qingfeng Zhang, Zhixiang Huang, Yingshui Xia


International Advisory Committee


Arun Chandrasekhar

Jianming Jin
Qing Huo Liu
Andreas C. Cangellaris
Jose Schutt-Aine
Ramachandra Achar
Antonio Orlandi
Joungho Kim
Rushan Chen
Christan Schuster
Jun Fan
Toshio Sudo
Erping Li
Junfa Mao
Tzong-Lin Wu
Erxiao Liu
Kai Kang
Wei Hong
Gaofeng Wang
Ke-Li Wu
Wen-Yan Yin
Hideki Asai
Madhavan Swaminathan
Weng Cho Chew
James L Drewniak
Qiang Chen
Zhongxiang Shen



Technical Program Committee


Arun Chandrasekhar

Linsheng Wu

Xiaoxiong Gu

Andreas Cangellaris

Lingling Sun

Xiuying Zhang

Antonio Maffucci

Libo Qian

Xingchang Wei

Christan Schuster

Madhavan Swaminathan

Xiamin Zhang

Fujiang Lin

Meisong Tong

Xiaochu Li

Gang Dai

Min Tang

Xiaoning Ye

Haiwen Liu

Pingqi Gao

Xiaopeng Yu

Hideki Asai

Qiang Chen

Xue Quan

Hongsheng Chen

Qifeng Liu

Xunya Jiang

Hongli Peng

Ran Hao

YaLi Wang

Hui Tan

Ramachandra Achar

Yi Zhao

Ivan Ndip

Sheng Sun

Yongle Wu

Jianyong Xie

Shaoqiu Xiao

Yongxin Guo

Jianyi Yang

Shurong Dong

Yonghu Zeng

Jian Wang

Taijun Liu

Yufeng Jin

Jose Schutt-Aine

Toshio Sudo

Yue Ping Zhang

Joungho Kim

Tzong-Lin Wu

Yujian Cheng

Jun Huang

Wenchao Chen

Zhenhong Fan

Kaixue Ma
Wenjian Yu
Zhizhang Chen 
Ling Feng
Wenquan Che 
Zhuo Cheng 
Lijun Jiang
Wei Sha

Liandong Wang
Wensheng Zhao



Award Committee Co-Chairs

Yue Ping Zhang, Ke -Li Wu, Shurong Dong

Publicity Committee Co-Chairs

Yang Xu, Xingchang Wei

Sponsorship & Exhibition Co-Chairs

Shurong Dong, Linsheng Wu, Wenchao Chen

Finance Co-Chairs

Ran Hao, Hao Xie

Local Arrangements Co-Chairs

Yang Du, Xiaopeng Yu

Conference Secretary

Cheng Ning, Nuojun Lin(Caroline)

E-mail: ningch@zju.edu.cn , Zllnnj@zju.edu.cn

Andreas C Cangellaris
M. E. Van Valkenburg Professor in Electrical and Computer Engineering
Dean, College of Engineering

Kaustav Banerjee

University of California, Santa Barbara

2D Materials for Smart Life


Tetsu Tanaka

Tohoku University, Sendai, Japan

3D-IC Technology: Reliability Challenges and Biomedical Application


Jun Fan

EMC Laboratory, Missouri University of Science and Technology

Signal Integrity Designs of HBM in 3D Packaging